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US Treasury (Inflation Linked) 0.75% 07/28
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Regulated by the Monetary Authority of Singapore
Bond Information
Description
Current Coupon
0.75%
Maturity Date
15/07/2028
Credit Risk
Low
Currency
USD
Seniority
Unsecured
Coupon Type
Fixed (Inflation-Linked)
Country
USA
Industry Type
Sovereign
Callable
No
Perpetual
No
Guarantor
None
RatingsUnrated
Issuer Rating1
Unrated
Last Rating Action
Not Applicable
Issuer Rating Watch/Outlook
Not Applicable
Issue Rating2
Unrated
Last Rating Action
Not Applicable
Yield Analysis
Yield3
1.27
Yield to Call
Not Applicable
Z Spread (bps)
32.4
Duration
1.64
Next Coupon Date
15/07/2023
Accrued Interest
0.116
Next Call Date
Not Applicable
Next Call Price
Not Applicable
Liquidity
Very Liquid
Next Reset Date
Not Applicable
Reset Index (Current Level)
Not Applicable
Spread
Not Applicable
Reset Index
Not Applicable
Additional Information
ISIN Code
US912828Y388
Registration Type
Auction
Amount Issued
36,672,000,000
Amount Outstanding
36,502,000,000
Issue Date
31/07/2018
Issue Price
96.730757
Coupon Frequency
2
Day Count
ACT/ACT
Redemption Value
115.6560535
Min. Denomination
100
Footnotes:
1 Issuer rating is the Long-Term Issuer Default Rating (IDR). Ratings data provided by Fitch Ratings.
2 Issue rating is the Long-Term Issue Rating. Ratings data provided by Fitch Ratings.
3 Yield displays YTM. Exceptions are perpetuals, which will display "Not Applicable", and fix-to-float bonds, which will assume constant rate of coupon projection.
Last traded data sourced from BondCliQ.