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Nippon 6.25% 09/53
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Regulated by the Monetary Authority of Singapore
Bond Information
Description
Current Coupon
6.25%
Maturity Date
13/09/2053
Credit Risk
Low
Currency
USD
Seniority
Subordinated
Coupon Type
Fixed-Fixed (Margin-over Index)
Country
JPN
Industry Type
Insurance
Callable
Yes
Perpetual
No
Guarantor
None
RatingsA
Issuer Rating1
A
Last Rating Action
Affirmed on 2024-11-18
Issuer Rating Watch/Outlook
Rating Outlook Positive
Issue Rating2
Unrated
Last Rating Action
Not Applicable
Yield Analysis
Yield3
5.63
Yield to Call
5.63
Z Spread (bps)
149.5
Duration
6.57
Next Coupon Date
13/03/2025
Accrued Interest
0.017
Next Call Date
13/09/2033
Next Call Price
100
Liquidity
Very Liquid
Next Reset Date
13/09/2033
Reset Index (Current Level)
4.020%
Spread
295.4bp
Reset Index
H15T5Y (US Treasury Yield Curve Rate T 5Y)
Additional Information
ISIN Code
USJ54675BC69
Registration Type
Regulation S
Amount Issued
930,000,000
Amount Outstanding
930,000,000
Issue Date
13/09/2023
Issue Price
100
Coupon Frequency
2
Day Count
ISMA-30/360
Redemption Value
100
Min. Denomination
200,000
Footnotes:
1 Issuer rating is the Long-Term Issuer Default Rating (IDR). Ratings data provided by Fitch Ratings.
2 Issue rating is the Long-Term Issue Rating. Ratings data provided by Fitch Ratings.
3 Yield displays YTM. Exceptions are perpetuals, which will display "Not Applicable", and fix-to-float bonds, which will assume constant rate of coupon projection.
Last traded data sourced from BondCliQ.